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Global Navigational Receiver Semiconductor Chip (dhruva) Development For Navic/gps/galileo/beidou
Project Description :

The kargil war underlined the need for india to be self-reliant in navigation technology. the navic satellites have been available for location services in the indian subcontinent for the past few years. however, no commercial receiver chip has been available for all the navic bands until the last two years. all of the current navigation rf front-ends used in india are not indigenous, highlighting the strong need for self-reliance in the area of semiconductor ic design for commercial and security applications in the country. dhruva is the first indigenous navigation receiver rf front-end integrated circuit (ic, chip, rfic, rf chip) developed in india at iit bombay, primarily targeted for positioning services in civilian applications by navic and gps. this chip can clean up all the interfering signals, sifting out the weak desired navigation signals. these are amplified approximately 400,000 times before converting to digital bits using on-chip analog-to-digital converters (adcs). the digital data from dhruva can then be further processed by any standard digital signal processor to determine one’s location accurately. dhruva is capable of tuning to the navigation signals transmitted by navic, gps, galileo, and beidou at multiple frequencies viz. 1.176 ghz (l5-band), 1.227 ghz (l2-band), 1.575 ghz (l1-band), and 2.492 ghz (s-band), making it a truly universal solution. the proposed cmos receiver chip is fully reconfigurable and fabricated in 65 nm cmos technology and verified with post-silicon measurements by december 2021. the measured performance confirms that the proposed receiver meets the specifications desired for a global navigation receiver. the key advantage of this receiver chip is it can be programmed to the navigation frequency bands without change in external components on the printed circuit board (pcb), reducing the complexity of the overall receiver system, which is not the case with existing commercial rf chips. the rf chip, with a die size of 1.85 mm x 1.85 mm, is developed as a production-level ic with esd protection, on-chip testing, and reference circuits operating from -40 to 100 °c. from a 1.2 v supply, the ic consumes < 50 mw of power in any frequency band of operation using tunable rf circuits and an on-chip frequency synthesizer. the filter bandwidth can be varied from 2 to 24 mhz for standard positioning and restricted navigation services (sps and rs). an on-chip 3-bit adc digitizes the analog signals for sps applications. the chip can be programmed by an external controller through the spi interface. dhruva is successfully interfaced with an fpga-based digital correlator and processor-based correlator to verify the end-to-end navigation, determining the receiver coordinates using navic and gps signals in l5, l1, and s frequency bands. a next-generation rf front-end, dhruvapro, is designed and fabricated in 65nm cmos technology in july 2022, incorporating feedback on dhruva from commercial entities. dhruvapro is enabled with several additional features, such as passive antenna support, flexible digital bit encoding, etc., as suggested by the commercial vendors. dhruvapro chips were delivered by the fabrication foundry in april 2023. the post-silicon measurements of the chip confirm the satisfactory rf performance in all four navigation frequency bands. dhruvapro can be adopted in commercial navigation receiver modules for vehicle tracking, iot/smart devices using navic, or any other satellite navigation system. dhruva rfics are indigenously developed and are the first of their kind developed in india. while dhruva and dhruvapro are primarily targeted for civilian navigation (standard positioning services), they can also be used for accurate positioning in security applications (restricted services).

 
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Project Details :
  • Date : Nov 19,2023
  • Innovator : vijaya kumar kanchetla
  • Team Members : Vijaya Kumar Kanchetla,Rajesh Zele,Shubham Jain,Ajinkya Kharalkar
  • Guide Name : Prof. Rajesh Zele
  • University : Indian Institutes of Technology Bombay
  • Submission Year : 2023
  • Category : Electronics, Communications & related fields
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